Investigation of the Thermal Conductivity of Silicon-Base Composites: The Effect of Filler Materials and Characteristic on Thermo-Mechanical Response of Silicon Composite

Thermal conductivity is a key property in many applications from electronic to informatics. The interaction of fillers with Sylgard 184 was studied; this study explores new composites and the influence metal particles (copper nickel), carbon-based materials (carbon nanotubes carbon black), ceramic nanoparticles (boron nitride) as enhance thermal properties silicon-based composites. effect on final performances composite evaluated. filler volume, dimension, morphology, chemical nature studied. Specifically, FT-IR analysis used evaluate curing polymer matrix. DSC confirm data further characterize Thermo-mechanical were studied by DMTA. morphology analyzed SEM. Finally, compared, enlightening correlation features fillers. results demonstrate remarkable dependence among type, size, shape filler, materials. Underlining that volume influenced obtaining best highest added higher positive impact k reached large irregular shapes. In contrast, increase amount affects rigidity silicon-matrix, increasing